Beng Chin Kang : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (15)
Les plus populaires
Liste
- Liste
- Tableau

1

From Bulk to Monolayer MoS2: Evolution of Raman Scattering

Hong Li, Qing Zhang, Chin Chong Ray Yap, Beng Kang Tay, Teo Hang Tong Edwin, Aurelien Olivier, Dominique Baillargeat

Journal:

Advanced Functional Materials

Année:

2012

Langue:

english

Fichier:

PDF, 2.02 MB

english, 2012

2

A switchable hydrophobic cavity of disodium 1,8-disulfonato-3,4,5,6-acridinetetracarboxylic acid

Bo-Long Poh, Beng Chin Kang

Journal:

Année:

1997

Langue:

english

Fichier:

PDF, 132 KB

english, 1997

3

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Plasmon resonances of carbon-nanotube-based dipole antennas for nano-interconnects

Franck, Pierre, Brun, Christophe, Yap Chin Chong,, Tan, Dunlin, Teo Hang Tong, Edwin, Bila, Stephane, Baillargeat, Dominique, Beng Kang Tay,

Année:

2011

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2011

4

Carbon nanotube bumps for the flip chip packaging system

Chin Chong Yap, Christophe Brun, Dunlin Tan, Hong Li, Edwin Hang Tong Teo, Dominique Baillargeat, Beng Kang Tay

Journal:

Nanoscale Research Letters

Année:

2012

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2012

5

[IEEE 2013 IEEE International Nanoelectronics Conference (INEC) - Singapore, Singapore (2013.01.2-2013.01.4)] 2013 IEEE 5th International Nanoelectronics Conference (INEC) - The influence of titanium nitride barrier layer on the properties of CNT bundles

Yap, Chin Chong, Tan, Dunlin, Brun, Christophe, Li, Hong, Teo, Edwin Hang Tong, Dominique, Baillargeat, Tay, Beng Kang

Année:

2013

Langue:

english

Fichier:

PDF, 2.70 MB

english, 2013

6

Identifying the mechanisms of p-to-n conversion in unipolar graphene field-effect transistors

Yap, Ray Chin Chong, Li, Hong, Chow, Wai Leong, Lu, Cong Xiang, Tay, Beng Kang, Teo, Edwin Hang Tong

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 1.01 MB

english, 2013

7

Flip Chip Based on Carbon Nanotube–Carbon Nanotube Interconnected Bumps for High-Frequency Applications

Brun, Christophe, Yap, Chin Chong, Tan, Dunlin, Bila, Stephane, Pacchini, Sebastien, Baillargeat, Dominique, Tay, Beng Kang

Journal:

IEEE Transactions on Nanotechnology

Année:

2013

Langue:

english

Fichier:

PDF, 429 KB

english, 2013

8

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Carbon nanotube array as high impedance interconnects for sensing device integration

Tan, Dunlin, Yap, Chin Chong, Hee, David, Yu, JongJen, Reverchon, Jean-Luc, Bois, Philippe, Baillargeat, Dominique, Tay, Beng Kang

Année:

2013

Langue:

english

Fichier:

PDF, 1.30 MB

english, 2013

9

[IEEE 2011 IEEE 4th International Nanoelectronics Conference (INEC) - Tao-Yuan, Taiwan (2011.06.21-2011.06.24)] The 4th IEEE International NanoElectronics Conference - Electrical transport in carbon nanotube intermolecular p-n junctions

Li, Hong, Zhang, Qing, Yap, Chin Chong, Tay, Beng Kang

Année:

2011

Langue:

english

Fichier:

PDF, 324 KB

english, 2011

10

[IEEE 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011 - Baltimore, MD, USA (2011.06.5-2011.06.10)] 2011 IEEE MTT-S International Microwave Symposium - Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

Brun, Christophe, Chong, Yap Chin, Tan, Dunlin, Teo Hang Tong, Edwin, Bila, Stephane, Verdeyme, Serge, Baillargeat, Dominique, Tay, Beng Kang

Année:

2011

Langue:

english

Fichier:

PDF, 911 KB

english, 2011

11

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging

Yap, Chin Chong, Dunlin Tan,, Brun, Christophe, Edwin Hang Tong Teo,, Jun Wei,, Dominique, Baillargeat, Beng Kang Tay,

Année:

2011

Langue:

english

Fichier:

PDF, 1.41 MB

english, 2011

12

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Hybrid EM/circuit modeling for carbon nanotubes based interconnects

Brun, Christophe, Franck, Pierre, Yap Chin Chong,, Tan, Dunlin, Teo Hang Tong, Edwin, Bila, Stephane, Baillargeat, Dominique, Tay, Beng Kang

Année:

2011

Langue:

english

Fichier:

PDF, 1.56 MB

english, 2011

13

Impact of the CNT growth process on gold metallization dedicated to RF interconnect applications

Yap, Chin Chong, Tan, Dunlin, Brun, Christophe, Li, Hong, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang

Journal:

International Journal of Microwave and Wireless Technologies

Année:

2010

Langue:

english

Fichier:

PDF, 541 KB

english, 2010

14

Carbon Nanostructures Dedicated to Millimeter-Wave to THz Interconnects

Brun, Christophe, Wei, Tan Chong, Franck, Pierre, Chong, Yap Chin, Congxiang, Lu, Leong, Chow Wai, Tan, Dunlin, Kang, Tay Beng, Coquet, Philippe, Baillargeat, Dominique

Journal:

IEEE Transactions on Terahertz Science and Technology

Année:

2015

Langue:

english

Fichier:

PDF, 1.73 MB

english, 2015

15

A Simple Approach Low-Temperature Solution Process for Preparation of Bismuth Doped-ZnO Nanorods and Its Application in Hybrid Solar Cells

Ginting, Riski Titian, Lee, Hock Beng, Tan, Sin Tee, Tan, Chun Hui, Jumali, Mohammad Hafizuddin B. Hj., Yap, Chi Chin, Kang, Jae-Wook, Yahaya, Muhammad

Journal:

The Journal of Physical Chemistry C

Année:

2015

Langue:

english

Fichier:

PDF, 2.16 MB

english, 2015